Description

Amazon Web Services (AWS) provides a highly reliable, scalable, low-cost cloud infrastructure platform that powers hundreds of thousands of businesses in 190+ countries around the world. We have data center locations in the U.S., Europe, and Asia, and customers across all industries.

Within AWS, Annapurna Labs team is building the next generation cloud server infrastructure. Our success depends on delivering world-class server infrastructure; we're handling massive scale and rapid integration of emergent technologies. Our servers include accelerators such as AWS Inferentia and AWS Trainium which are machine learning products designed to deliver high performance at low cost.

We are seeking a talented and motivated Manufacturing Engineer with a proven track record of implementing best in class test techniques and processes within a complex supply chain in Asia. As a member of the Cloud-Scale Machine Learning Acceleration team, you will be the interface between the system engineering team and the ODM and CM partners in Asia. In this role, you will:

• Work with system engineering teams to identify and escalate manufacturing challenges by enforcing DFM, DFA and DFS principles,

• Evaluate, investigate and introduce new manufacturing technology and methodology to enhance product quality and production efficiency at ODM and CM,

• Develop or adapt manufacturing process at the ODM and CM, including defining fixture requirements, critical assembly requirements, test methodology, signal integrity, power and heat management requirement,

• Drive all factory-related operational issues related to assembly processes during pre-production builds; ensure effective closure to enable operational success of the new product introduction cycle, and put products into mass production,

• Manage product lifecycle changes, lead product quality and reliability improvement projects, and drive technical root cause for supplier defects

• Implement and optimize manufacturing 1st pass yields and efficiency from prototype through product ramp

• Work with engineering teams in US to clearly represent process and reviews to enable smooth New Product Introduction and changes

• Support cost reduction and sustaining activities

The successful candidate will be capable of making wide-ranging business decisions on behalf of the organization and willing to “roll up sleeves and do what needs to get done” to consistently deliver results. We’re changing an industry, and we want individuals who are ready for this challenge and want

We are open to hiring candidates to work out of one of the following locations:

Taipei, TPE, TWN

Basic Qualifications

- - BS in mechanical engineering or a related technical field

- - 5+ years of experience in a related engineering field

- - Experience in printed circuit boards (PCB) assembly, including solder paste, chip mounting, reflow soldering, advanced heat sink mounting.

- - Experience in PCB inspection and metrology including optical, Lasers, X-ray, 3D,

- - Experience with signal integrity and power integrity measurement techniques,

- - Experience in process characterization and validation using statistical tools and Design of Experiments.

- - Experience with design for manufacturability, design for automation, and creating process documentation from scratch

- - Experience with failure analysis techniques to evaluate production, supplier and field failures to drive root cause analysis and resolution.

- - Experience in integration of production testing infrastructure and deployment of production test suites

- - Experience working with International ODM and CM Partners)

Preferred Qualifications

• Experience with distributed systems at scale

• • Ability to work independently and ensure timely and accurate communication between the Annapurna Labs and our JDM/OEM partners
• • Experience in high power designs
• • Good understanding of manufacturing strategy and DFMA best practices
• • Experienced with CAD software
• • Experience with Statistical Analysis Software
• • Mechanically inclined, strong problem-solving skills, hands-on individual
• • Excellent oral and written communication skills; capable of interfacing at all levels of a business from equipment operators to platform VP